MB75-3001-1211-C0
- Mfr.Part #
- MB75-3001-1211-C0
- Manufacturer
- SECO
- Package/Case
- -
- Datasheet
- Download
- Description
- Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1202B @ 2.5GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp
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- Manufacturer :
- SECO
- Product Category :
- Computer-On-Modules - COM
- Dimensions :
- 95 mm x 95 mm
- Form Factor :
- COM Express Type 6
- Frequency :
- 2.5 GHz
- Interface Type :
- Audio, I2C, PCIe, SPI, USB
- Maximum Operating Temperature :
- + 60 C
- Minimum Operating Temperature :
- 0 C
- Operating Supply Voltage :
- 12 V
- Processor Brand :
- AMD
- Processor Type :
- V1202B
- Datasheets
- MB75-3001-1211-C0
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Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| MB75-4001-1211-C0 | SECO | 52 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp |
| MB75-4001-2111-C0 | SECO | 52 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp |
| MB75-6001-2111-C0 | SECO | 56 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp |
| MB75-6002-1111-C0 | SECO | 52 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I210 - EDP Port - HUB - Comm. Temp |
| MB75-6002-1211-C0 | SECO | 52 | Computer-On-Modules - COM COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp |
| MB75-DISS-1-PK | SECO | 52 | Heat Sinks COM Express Type 6 - COMe-B75-CT6 Heat Spreader (PASSIVE) - Packaged |
| MB75-DISS-3-PK | SECO | 52 | Heat Sinks COM Express Type 6 - COMe-B75-CT6 Heat Sink (ACTIVE) - Packaged |
