HMTSW-133-08-G-D-170-RA-007
- Manufacturer :
- Samtec
- Product Category :
- Board to Board & Mezzanine Connectors
- Contact Material :
- Phosphor Bronze
- Contact Plating :
- Gold
- Housing Material :
- Liquid Crystal Polymer (LCP)
- Maximum Operating Temperature :
- + 125 C
- Minimum Operating Temperature :
- - 55 C
- Mounting Angle :
- Right Angle
- Number of Positions :
- 66 Position
- Number of Rows :
- 2 Row
- Packaging :
- Bulk
- Pitch :
- 2.54 mm
- Product :
- Headers
- Series :
- HMTSW
- Termination Style :
- Solder
- Datasheets
- HMTSW-133-08-G-D-170-RA-007
Manufacturer related products
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SamtecBoard to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal -
SamtecBoard to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
-
SamtecBoard to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
-
SamtecBoard to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
-
SamtecBoard to Board & Mezzanine Connectors 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
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