TS991SNL500T3

Mfr.Part #
TS991SNL500T3
Manufacturer
Chip Quik
Package/Case
-
Datasheet
Download
Description
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (500g jar)

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Manufacturer :
Chip Quik
Product Category :
Solder
Alloy :
Sn96.5/Ag3.0/Cu0.5
Contains Lead :
NO
Description/Function :
Synthetic No-Clean
Package Type :
Jar
Product :
Solder
Size :
500 g
Type :
Paste, No Clean
Datasheets
TS991SNL500T3

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