533521B02552G
- Mfr.Part #
- 533521B02552G
- Manufacturer
- Aavid, Thermal Division of Boyd Corporation
- Package/Case
- -
- Datasheet
- Download
- Description
- Heat Sinks Extruded Style Heat Sink for Dual TO-218, Large Radial Fins, Vertical Mounting, 4.5 n Thermal Resistance, Black Anodized, 2.67mm Hole, 50.8x21.59mm, 2 Device Clips #52
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- Manufacturer :
- Aavid, Thermal Division of Boyd Corporation
- Product Category :
- Heat Sinks
- Designed for :
- TO-218 x 2
- Heatsink Material :
- Aluminum
- Product :
- Heat Sinks
- Datasheets
- 533521B02552G
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533502B02552G | Aavid, Thermal Division of Boyd Corporation | 52 | Heat Sinks Extruded Style Heat Sink for TO-220, Large Radial Fins, Vertical Mounting, 4.5 n Thermal Resistance, Black Anodized, 2.67mm, Device Clip #52 Hole, 50.8x18.29mm |
533514-1 | TE Connectivity / AMP Connectors | 52 | High Speed / Modular Connectors HDI RECP ASSY 3 ROW |
533522B02552G | Aavid, Thermal Division of Boyd Corporation | 52 | Heat Sinks Extruded Style Heat Sink for Dual TO-220, Large Radial Fins, Vertical Mounting, 2.7 n Thermal Resistance, Black Anodized, 2.67mm Hole, 50.8x18.29mm, 2 Device Clips #52 |
53353-1071 | Molex | 10,793 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy S T SMT 10CktEmbsTpPkg |
53353-1671 | Molex | 52 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy S T SMT 16CktEmbsTpPkg |
53353-1871 | Molex | 52 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy S T SMT 18CktEmbsTpPkg |
53353-2071 | Molex | 52 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer Assy S T SMT 20CktEmbsTpPkg |
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53353-3071 | Molex | 160 | Board to Board & Mezzanine Connectors 0.8 BtB Wafer AssyST SMT 30CktEmbsTpPkg |
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